{"id":13,"date":"2025-08-24T18:38:27","date_gmt":"2025-08-24T10:38:27","guid":{"rendered":"http:\/\/120.46.146.92\/?p=13"},"modified":"2025-08-24T18:38:27","modified_gmt":"2025-08-24T10:38:27","slug":"pcb%e7%bc%ba%e9%99%b7%e8%8b%b1%e6%96%87%e6%9c%af%e8%af%ad","status":"publish","type":"post","link":"http:\/\/120.46.146.92\/index.php\/2025\/08\/24\/pcb%e7%bc%ba%e9%99%b7%e8%8b%b1%e6%96%87%e6%9c%af%e8%af%ad\/","title":{"rendered":"PCB\u7f3a\u9677\u82f1\u6587\u672f\u8bed"},"content":{"rendered":"\n<ul class=\"wp-block-list\"><\/ul>\n\n\n\n<p class=\"has-text-align-left\"><em><strong>1. Bevelling defect \u2013 \u5012\u8fb9\u4e0d\u826f<br>2. Blistering (Cu plating) \u2013 \u9540\u5c42\u8d77\u6ce1<br>3. Blistering (HSAL) \u2013 \u55b7\u9521\u8d77\u6ce1<br>4. Block hole \u2013 \u585e\u5b54<br>5. Board contamination \u2013 \u677f\u6c61<br>6. Broken annular ring \u2013 \u710a\u76d8\u5d29\u7f3a<br>7. Burr \u2013 \u62ab\u950b<br>8. Burnt \u2013 \u677f\u7126\u9ec4<br>9. Burr \u2013 \u62ab\u950b<br>10. Chamfering \u2013 \u659c\u5207<br>11. Copper in NPTH \u2013 \u975e\u9540\u94dc\u5b54\u6709\u94dc<br>12. Copper\/Nickel peel off \u2013 \u94dc\u3001\u954d\u8131\u843d<br>13. Copper residue \u2013 \u94dc\u788e<br>14. Copper thickness out of requirement \u2013 \u94dc\u9540\u5c42\u539a\u5ea6\u8d85\u8981\u6c42<br>15. Crazing \u2013 \u767d\u6591<br>16. Cu plating \u2013 \u94dc\u6d82\u5c42<br>17. Damaged board \u2013 \u677f\u635f\u574f<br>18. Date code \u2013 \u65e5\u671f\u4ee3\u7801<br>19. Delamination (Raw material) \u2013 \u5206\u5c42\uff08\u539f\u6750\u6599\uff09<br>20. Dewetting \u2013 \u4e0d\u4e0a\u9521<br>21. D\/F Mis-registration \u2013 \u5e72\u819c\u79fb\u4f4d<br>22. D\/F Peel off \u2013 \u5e72\u819c\u8131\u843d<br>23. D\/F Residue \u2013 \u5e72\u819c\u788e<br>24. Dewetting \u2013 \u4e0a\u9521\u4e0d\u826f<br>25. Engineering Evaluation \u2013 \u5de5\u7a0b\u8bd5\u9a8c\u8bc4\u4f30<br>26. Extra hole \u2013 \u591a\u5b54<br>27. Extra opening \u2013 \u591a\u5f00\u7a97\u53e3<br>28. Expose trace \u2013 \u9732\u7ebf<br>29. Excessive inner core \u2013 \u5185\u5c42\u4e0d\u914d\u5957<br>30. Excessive inner core \u2013 \u5185\u5c42\u8fc7\u539a<br>31. Foreign material \u2013 \u5185\u5c42\u6742\u7269<br>32. G\/F ENIG Cu \u2013 \u8df3\u7ebf\u7535\u9540\uff08G\/F ENIG Cu\uff09<br>33. Gold discoloration \u2013 \u91d1\u9762\u989c\u8272\u4e0d\u826f<br>34. Gold Finger discoloration \u2013 \u91d1\u624b\u6307\u989c\u8272\u4e0d\u826f<br>35. Gold surface \u2013 \u91d1\u9762<br>36. Gold surface \u2013 \u91d1\u9762<br>37. Gold finger peel off \u2013 \u91d1\u624b\u6307\u8131\u843d<br>38. Gold finger peel off \u2013 \u91d1\u624b\u6307\u8131\u843d<br>39. Green oil \u2013 \u7eff\u6cb9<br>40. Green oil \u2013 \u7eff\u6cb9<br>41. HSAL \u2013 \u55b7\u9521<br>42. HSAL \u2013 \u55b7\u9521<br>43. Hole breakout \u2013 \u5d29\u5b54<br>44. Hole oversize \u2013 \u5b54\u5f84\u5927<br>45. Hole roughness(Cu plating) \u2013 \u5b54\u7c97\u7cd9\uff08\u94dc\u6d82\u5c42\uff09<br>46. Hole roughness(mechanical drill) \u2013 \u5b54\u7c97\u7cd9\uff08\u673a\u68b0\u94bb\u5b54\uff09<br>47. Hole shift \u2013 \u504f\u5b54<br>48. Hole undersize \u2013 \u5b54\u5f84\u5c0f<br>49. Hole void (Cu) \u2013 \u5b54\u58c1\u7f3a\u53e3\uff08\u94dc\uff09<br>50. IC barrier \u2013 IC\u680f<br>51. Illegible date code \u2013 \u4e0d\u6e05\u695a\u7684\u65e5\u671f\u4ee3\u7801<br>52. Illegible legend \u2013 \u4e0d\u6e05\u6670\u7684\u56fe\u4f8b<br>53. Illegible marking (exposure) \u2013 \u6807\u5fd7\u4e0d\u6e05\uff08\u66dd\u5149\uff09<br>54. Impedance out of requirement \u2013 \u963b\u6297\u8d85\u51fa\u8981\u6c42<br>55. Incomplete drilling \u2013 \u5b54\u672a\u7a7f<br>56. Incomplete S\/M plugging \u2013 \u585e\u5b54\u4e0d\u6ee1<br>57. Impedance out of requirement \u2013 \u963b\u6297\u8d85\u51fa\u8981\u6c42<br>58. Incomplete S\/M plugging \u2013 \u585e\u5b54\u4e0d\u6ee1<br>59. Inner open \u2013 \u5185\u5c42\u5f00\u8def<br>60. Inner over etching \u2013 \u5185\u5c42\u8680\u523b\u8fc7\u5ea6<br>61. Inner pattern mis-registration \u2013 \u5185\u5c42\u56fe\u6848\u9519\u4f4d<br>62. Inner short \u2013 \u5185\u5c42\u65ad\u8def<br>63. Layer to layer mis-registration \u2013 \u5c42\u4e0e\u5c42\u9519\u4f4d<br>64. Legend in Hole \u2013 \u5b57\u7b26\u5165\u5b54<br>65. Legend on pad \u2013 \u5b57\u7b26\u4e0a\u710a\u76d8<br>66. Legend peel off \u2013 \u5b57\u7b26\u8131\u843d<br>67. Measling (HSAL) \u2013 \u767d\u70b9\uff08\u55b7\u9521\uff09<br>68. Measling (Pressing) \u2013 \u767d\u70b9\uff08\u538b\u677f\uff09<br>69. Measling (Pressing) \u2013 \u767d\u70b9\uff08\u538b\u677f\uff09<br>70. Microsection (engineering) \u2013 \u5fae\u5207\u7247\uff08\u5de5\u7a0b\u8bd5\u9a8c\u7528\uff09<br>71. Microsection (outgoing) \u2013 \u5fae\u5207\u7247\uff08\u51fa\u8d27\uff09<br>72. Micro short \u2013 \u5fae\u77ed\u8def<br>73. Milling Defects \u2013 \u9523\u5751\u6b21\u54c1<br>74. Missing chamfering \u2013 \u6f0f\u659c\u5207<br>75. Missing legend ink \u2013 \u6f0f\u5370\u5b57\u7b26<br>76. Missing routing \u2013 \u6f0f\u9523<br>77. Missing routing \u2013 \u6f0f\u9523<br>78. Ni\/Cu exposure \u2013 \u9732\u954d\u3001\u94dc<br>79. Nick (G\/F) \u2013 \u7f3a\u53e3<br>80. Nick \/ void on pad \u2013 \u7f3a\u53e3 \/ \u9488\u5b54<br>81. Nick \/ void on trace \u2013 \u5d29\u7ebf\u3001\u7ebf\u8def\u7f3a\u53e3<br>82. Non wetting \u2013 \u4e0d\u4e0a\u9521<br>83. Outer open \u2013 \u5916\u5c42\u5f00\u8def<br>84. Outer over etching \u2013 \u5916\u5c42\u8680\u523b\u8fc7\u5ea6<br>85. Outer short \u2013 \u5916\u5c42\u65ad\u8def<br>86. Over chamfering \u2013 \u659c\u8fb9\u8fc7\u5ea6<br>87. Over-exposure \u2013 \u66dd\u5149\u8fc7\u5ea6<br>88. Over thickness \u2013 \u677f\u8fc7\u539a<br>89. Oxidation under soldermask \u2013 \u7eff\u6cb9\u4e0b\u6c27\u5316<br>90. Pad peel off \u2013 \u710a\u76d8\u8131\u843d<br>91. Pattern mis-registration \u2013 \u56fe\u6848\u9519\u4f4d<br>92. Pink ring \u2013 \u7c89\u7ea2\u5708<br>93. Pink ring \u2013 \u7c89\u7ea2\u5708<br>94. Pink ring \u2013 \u7c89\u7ea2\u5708<br>95. Poor ENTEK \u2013 \u6d82\u5c42\u4e0d\u826f<br>96. Poor IC barrier \u2013 IC\u680f\u4e0d\u826f<br>97. Poor rework \u2013 \u8fd4\u5de5<\/strong><\/em><\/p>\n","protected":false},"excerpt":{"rendered":"<p>1. Bevelling defect \u2013 \u5012\u8fb9\u4e0d\u826f2. Blistering (Cu plating) \u2013 \u9540\u5c42\u8d77\u6ce13. Bli &#8230;<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"emotion":"","emotion_color":"","title_style":"","license":"","footnotes":""},"categories":[1],"tags":[],"class_list":["post-13","post","type-post","status-publish","format-standard","hentry","category-uncategorized"],"_links":{"self":[{"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/posts\/13","targetHints":{"allow":["GET"]}}],"collection":[{"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/comments?post=13"}],"version-history":[{"count":2,"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/posts\/13\/revisions"}],"predecessor-version":[{"id":15,"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/posts\/13\/revisions\/15"}],"wp:attachment":[{"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/media?parent=13"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/categories?post=13"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/120.46.146.92\/index.php\/wp-json\/wp\/v2\/tags?post=13"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}